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The lifespan for LED product mostly depend on its heat dissipation.So how to improve its heat dissipation is the key factor in technology.The mainly task is to resolve the dissipation through different ways,it is also the most competitive problem in this line.

Unlike traditional packaging application including Piranha packaging and SMD packaging, the LED lighting is dissipation becomes the primary technology problem for the heat is more concentrated and the heat dissipation is more difficult to be solved. In this case we developed superconductive secondary cooling technology to disperse the heat. By making use of this technology, it would effectively control LED junction temperature(under room temperature condition, the chip junction temperature below 60℃),and help LED lamps to achieve negative light decay within the 3,000h.We have got invention patent for it

In another way, from the LED chip point of view, it should be adopt new structure, new workmanship and increase the raw material heat resistance. It can be decrease the condition for heat dissipation through the above way. Also include the material between different metal, epoxy glue of phosphor, it can be make the heat resistance less than 10℃/W. Adopt the new material, also need the better ventilation, so that the heat can be release well while the temperature will be less than 30 degree.